IC tester and measuring method
US5574383A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 2, 1995 |
| Grant date | Nov 12, 1996 |
| Priority date | — |
| Expiry date | Feb 2, 2015 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R1/0433
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An IC measuring and testing device and measuring and testing method comprising a measurement handler socket provided with mold-receiving base having guiding members corresponding to the shape of a mold body of an IC to be tested around its periphery and probes for contacting outer leads of the IC, and a suction arm for suction-supporting the IC and transferring it to the mold-receiving base, the IC measuring and testing device performing measuring and testing on the IC mounted in the mold-receiving base by means of the suction arm, the guide members corresponding to and separated from the outer leads of the IC, and terminal portions of the probes being arranged inserted into these separation portions. As a result, when the IC is set, the guide members and the like of the socket can be prevented from striking against the outer leads of the IC and deforming them.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.