Combined board construction for burn-in and burn-in equipment for use with combined board
US5574384A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | May 15, 1995 |
| Grant date | Nov 12, 1996 |
| Priority date | — |
| Expiry date | May 15, 2015 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2817
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An apparatus for burn-in of semiconductor devices has board assemblies including a burn-in board and a driver board. The burn-in board has sockets on a first surface for accepting the semiconductor devices and first terminals extending from the sockets to protrude from a first back side of the burn-in board. The driver board has a second surface carrying an electronic circuit to drive the semiconductor devices and a second back side with second terminals for connecting the electronic circuit to the first terminals. The driver board has an edge connector with terminals for applying power to the electronic circuit. The burn-in board and the driver board are disposed with the first and second back sides facing such that corresponding ones of the first and second terminal can be brought into and out of contact with each other. The board assemblies are supported in a housing wherein the board assemblies form partitions isolating first and second environmental spaces for burn-in and cooling operation. A flexible seal is provided between the burn-in board and the driver board to permit said first and second terminals to be brought into contact with each other by pneumatic operation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.