Emulation system having a scalable multi-level multi-stage programmable interconnect network
US5574388A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 13, 1995 |
| Grant date | Nov 12, 1996 |
| Priority date | — |
| Expiry date | Oct 13, 2015 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F15/7867
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A scalable multi-level multi-stage network topology is employed to interconnect reconfigurable logic elements within the FPGA, inter-FPGA, interlogic boards, and inter-backplanes. More specifically, under the presently preferred embodiemnt, an on-chip 3-stage inter-logic element crossbar network is provided to each FPGA for interconnecting the reconfigurable logic elements and the I/O pins of the FPGA. A two level two-stage inter-FPGA crossbard network is provided to interconnect the FPGAs and I/O pins of the logic board. A two-level two-stage inter-board crossbar network is provided to interconnect the logic boards or I/O boards for interconnecting the logic elements to external devices. Finally, a single-stage inter-backplane network and a number of PCBs are provided to interconnect multi-backplanes to form a multi-crate system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.