Lumped parameter balun
US5574411A · kind A · utility
14Cited by
3References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 25, 1995 |
| Grant date | Nov 12, 1996 |
| Priority date | — |
| Expiry date | Sep 25, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H7/42
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A balun, which does not use magnetic coupling and is easily integrated in MMICs, is formed of lumped parameter inductive and capacitive circuit elements. In one embodiment, a termination circuit is utilized to prevent reflections of common mode signals.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.