Kinematic mounting of optical and optoelectronic elements on silicon waferboard
US5574561A · kind A · utility
33Cited by
5References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 22, 1994 |
| Grant date | Nov 12, 1996 |
| Priority date | — |
| Expiry date | Dec 22, 2014 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/423
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The present invention relates to a novel, accurate, passive alignment of optical and optoelectronic elements using silicon waferboard technology. The invention particularly relates to the use of etched v-grooves on monocrystalline materials in conjunction with alignment spheres to effect the passive alignment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.