Solid state microwave integrated circuit RF insulator-encapsulated contact installation and removal processes
US5575417A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 31, 1995 |
| Grant date | Nov 19, 1996 |
| Priority date | — |
| Expiry date | Jan 31, 2015 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2101/40
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Apparatus and processes for desoldering and soldering an insulator-encapsulated contact using a focused heat source and thermal choke in the form of a soldering iron tip and a contact moat. The desoldering and removal process includes the following steps. Securing the housing to minimize movement thereof. Heating a soldering iron to approximately 825.degree. C. Tinning the tip of the soldering iron with solder and flux. Engaging the contact from the rear using an extraction tool. Disposing flux on the solder joint. Contacting the soldering iron with the contact. Disposing the soldering iron in the moat while outward pressure is exerted with an extraction tool. After a predetermined delay, using the extraction tool to vacuum out the contact, while simultaneously removing the soldering iron and pushing out the contact, whereafter the contact is desoldered and seated in the extraction tool. Removing the contact from the extraction tool and removing the tool from the housing. The soldering or installation process comprises the following steps. Preparing a tinned contact for installation by surrounding its contact pin with teflon sleeves. Disposing flux in a central through hole in the …
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.