Methods for connecting flexible circuit substrates to contact objects and structures thereof
US5575662A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 11, 1994 |
| Grant date | Nov 19, 1996 |
| Priority date | — |
| Expiry date | Aug 11, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A connecting method comprising laminating a flexible circuit substrate having a plurality of bump contacts with a contact object having a plurality of portions to be contacted such that the respective bump contacts face to the portions to be contacted at a joined surface, correspondingly each other to form a laminate, and applying pressure to the entire surface of the laminate in a compressing direction with pressurizing means provided so as to pinch the laminate in a laminating direction to contact the plural bump contacts mounted on the flexible circuit substrate with the plural portions to be contacted corresponding thereto mounted on the contact object, respectively.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.