Polishing composition
US5575837A · kind A · utility
72Cited by
5References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 6, 1995 |
| Grant date | Nov 19, 1996 |
| Priority date | — |
| Expiry date | Oct 6, 2015 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09G1/02
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A novel polishing composition composed of water, sol or gel of silica as a polishing agent, and a polishing accelerator has been obtained. The accelerator could be a persulfate compound, a persulfate compound combined with hydrogen peroxide, or a hydrazine compound. Another polishing composition composed of water, other polishing agent than silica and a hydrazine compound as a polishing accelerator has also been obtained.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.