Patent · US Expired

Mounting unit for a multilayer hybrid circuit having power components including a copper coated ceramic center board

US5576934A · kind A · utility

15Cited by

9References

5Claims

0Family size

Assignee

Robert Bosch GmbH · DE

Inventors

Walter Roethlingshoefer · Reutlingen, DE
Ulrich Goebels · Reutlingen, DE

Key dates

Filing date	Dec 9, 1995
Grant date	Nov 19, 1996
Priority date	—
Expiry date	Dec 9, 2015

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2203/049
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A mounting unit for a multilayer hybrid circuit having power components provides improved heat dissipation from the power components. The mounting unit includes a thermally conductive substrate board on which the multilayer hybrid circuit is mounted, the substrate board including a ceramic board that is coated with copper film.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.