Patent · US Expired

Aluminum-beryllium alloys having high stiffness and low thermal expansion for memory devices

US5578146A · kind A · utility

34Cited by
2References
14Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJan 16, 1996
Grant dateNov 26, 1996
Priority date
Expiry dateJan 16, 2016

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG11B21/083
  • WIPO fieldMaterials, metallurgy
  • WIPO sectorChemistry

Abstract

Articles of manufacture are made of aluminum-beryllium alloys having substantially randomly distributed aluminum-rich and beryllium rich phases to provide substantially isotropic mechanical properties, such as high stiffness and low coefficients of thermal expansion, whereby the articles of manufacture provide more rapid and accurate responses.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.