Aluminum-beryllium alloys having high stiffness and low thermal expansion for memory devices
US5578146A · kind A · utility
34Cited by
2References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 16, 1996 |
| Grant date | Nov 26, 1996 |
| Priority date | — |
| Expiry date | Jan 16, 2016 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B21/083
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
Articles of manufacture are made of aluminum-beryllium alloys having substantially randomly distributed aluminum-rich and beryllium rich phases to provide substantially isotropic mechanical properties, such as high stiffness and low coefficients of thermal expansion, whereby the articles of manufacture provide more rapid and accurate responses.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.