Method of encapsulating large substrate devices using reservoir cavities for balanced mold filling
US5578261A · kind A · utility
72Cited by
14References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 11, 1994 |
| Grant date | Nov 26, 1996 |
| Priority date | — |
| Expiry date | Aug 11, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S425/812
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Reservoir cavities have been used successfully to achieve proper mold filling of large area substrate packages with severe leading and lagging of flow fronts in the cavity halves, The additional plastic required to fill the reservoir cavities and the additional work in removing the reservoir culls is minimal, Reservoir cavities have been shown to eliminate void problems in molded packages with large printed wiring board substrates,
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.