Method for using rinse spray bar in chemical mechanical polishing
US5578529A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jun 2, 1995 |
| Grant date | Nov 26, 1996 |
| Priority date | — |
| Expiry date | Jun 2, 2015 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB08B3/02
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A rinse spray bar (24), added to CMP equipment (10), provides complete and uniform wetting and rinsing of the polishing pad (12) for an improved process. The rinse spray bar has a first opening (26) running through a portion of its length and multiple second openings (28) connected to the first opening to create multiple flow paths for a rinse agent. These second openings (28) are capped with spray nozzles (36) on the bottom surface of the rinse spray bar so that the rinse agent can be sprayed out from the second openings at a pressure higher than ambient such that the sprays patterns overlap each other to ensure uniform wetting. An in-line valve (34) adjusts and controls the pressure of the incoming rinse agent through the input line (30) so that the spray nozzle pressure can be varied. The rinse spray bar can be used at every polishing pad station in the CMP apparatus.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.