Polyimide precursor, bismaleimide-based cured resin precursor and electronic parts having insulating members made from these precursors
US5578697A · kind A · utility
21Cited by
5References
20Claims
0Family size
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Key dates
| Filing date | Mar 29, 1995 |
| Grant date | Nov 26, 1996 |
| Priority date | — |
| Expiry date | Mar 29, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31721
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A polyimide precursor having a molecular structure obtained by polymerizing (a) 0.97 to 1.03 molar equivalent of a diamine component containing 0.40 molar equivalent or more of aromatic diamine compound represented by the general formula (DA1), and (b) an acid anhydride component containing (1-n.sub.1 /2) molar equivalent of a tetracarboxylic dianhydride and n.sub.1 molar equivalent of at least one selected from the group consisting of maleic anhydride and maleic derivative anhydride, wherein n.sub.1 ranges from 0.02 to 0.40. ##STR1##
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.