Method of testing semiconductor device and test apparatus for the same
US5578919A · kind A · utility
12Cited by
9References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 20, 1995 |
| Grant date | Nov 26, 1996 |
| Priority date | — |
| Expiry date | Mar 20, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A tape carrier includes an elongated electrically insulating tape divided into a plurality of separable tape sections. A semiconductor chip is mounted at each of a plurality of semiconductor device mounting portions having a plurality of leads on each of the tape sections. The semiconductor chips are connected to the respective leads. A plurality of testing connection terminals on each of the tape sections are connected to respective testing connection terminals by testing wires.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.