Method for burn-in of high power semiconductor devices
US5579826A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 2, 1995 |
| Grant date | Dec 3, 1996 |
| Priority date | — |
| Expiry date | May 2, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S165/908
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A thermal control system for use with a burn-in system, the thermal control system capable of delivering a thermally preconditioned liquid to a plurality of semiconductor devices during burn-in. The thermal control system comprises a liquid reservoir containing a liquid, a pump, and a plurality of spray nozzle arrays. The liquid contained in the liquid reservoir is thermally preconditioned through the use of a heating element and a cooling element and the temperature of the liquid provided to each spray nozzle array is individually controlled through the use of a pipe heating element. The liquid is collected and returned to the liquid reservoir after being sprayed on the semiconductor devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.