Methods of removing semiconductor film with energy beams
US5580473A · kind A · utility
71Cited by
5References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 20, 1994 |
| Grant date | Dec 3, 1996 |
| Priority date | — |
| Expiry date | Jun 20, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/94
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of removing a prescribed portion of a semiconductor film or a metal film involves irradiating the prescribed portion to be removed with a first energy beam, and then with a second energy beam. The energy densities and beam widths of the first and second energy beams are each separately controlled or selected to avoid damaging an underlayer under the film and to reduce or avoid deformation of a periphery around the removed portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.