Method for minimizing unwanted metallization in periphery die on a multi-site wafer
US5580829A · kind A · utility
6Cited by
6References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 30, 1994 |
| Grant date | Dec 3, 1996 |
| Priority date | — |
| Expiry date | Sep 30, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/975
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and apparatus for providing a mask (200) on a multi-site wafer (100) is accomplished by first creating a first mask key (204) which contains information, such as alignment cues and test structures. A copy of the first mask key is modified to produce a second mask key (201). When the two mask keys are transferred to adjacent sites on the wafer, they physically overlap, preventing double-exposure of the information in the first mask key.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.