Aqueous ammonia composition
US5580847A · kind A · utility
Assignees
Inventors
Key dates
| Filing date | Jun 7, 1995 |
| Grant date | Dec 3, 1996 |
| Priority date | — |
| Expiry date | Jun 7, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/02052
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An aqueous ammonia composition having low surface tension is disclosed, which comprises ammonia water and a fluoroalkylsulfonamide compound having the following general formula: EQU R.sup.1 SO.sub.2 NR.sup.2 --X--H (I) PA1 wherein R.sup.1 represents a fluoroalkyl group, R.sup.2 represents a hydrogen atom or a lower alkyl group, X represents a grouping selected from CH.sub.2 COO and (CH.sub.2 CH.sub.2 O).sub.n, wherein n is a positive integer from 1 to 20. This aqueous ammonia composition may be mixed with an aqueous hydrogen peroxide solution and water so that it can be used for cleaning a semiconductor substrate. The cleaning solution has outstanding stability, and exhibits improved efficacy in removing microparticles of impurities and excellent surface-protecting effect on the semiconductor substrate that is useful in the manufacture of high density integrated circuit elements.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.