Polyimide resin composition
US5580918A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 16, 1994 |
| Grant date | Dec 3, 1996 |
| Priority date | — |
| Expiry date | Feb 16, 2014 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L79/08
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A polyimide resin composition comprising 50-95 parts by weight of a polyimide resin represented by the following formula (1): ##STR1## wherein X represents a direct bond, a hydrocarbon group, a carbonyl group, a thio group or so, Y.sub.1 -Y.sub.4 individually represent a hydrogen atom, a lower alkyl group or so and R.sub.1 represents an aliphatic group, an aromatic group or so; and 50-5 parts by weight of a polyetheretherketone, said composition having been subjected to heat treatment at 250.degree.-330.degree. C. and, after the heat-treatment, having crystallization enthalpy of 0-6 cal/g. The heat treatment of the polyimide resin composition can be effected at a low temperature in a short time. The polyimide resin composition has excellent dimensional stability and high-temperature physical properties. Moreover, it has excellent moldability and peeling resistance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.