Electronic surface mount device
US5581118A · kind A · utility
24Cited by
11References
18Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 23, 1995 |
| Grant date | Dec 3, 1996 |
| Priority date | — |
| Expiry date | Jun 23, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3421
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A surface mount package (10) includes a leadframe (14) facing away from the mounting surface such that the primary heat path is away from the mounting surface. The package may be a modified TO-220, wherein the tab (16) of the leadframe is bent down toward the mounting surface, and the leads (20) are bent down and under the package. Such an embodiment provides for a small footprint and is relatively easy to manufacture.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.