Embeddable device for contactless interrogation of sensors for smart structures
US5581248A · kind A · utility
32Cited by
52References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 14, 1993 |
| Grant date | Dec 3, 1996 |
| Priority date | — |
| Expiry date | Jun 14, 2013 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01D5/48
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Sensing device for a sensor embeddable in a structure comprising: an insulative substrate, a circuit pattern disposed on the substrate for interconnecting a plurality of electronic components, the circuit pattern comprising an inductive coil, the circuit pattern including pads for disposing components on the substrate and coupling the device to the sensor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.