Spring clip for clamping a heat sink module to an electronic module
US5581442A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jun 6, 1995 |
| Grant date | Dec 3, 1996 |
| Priority date | — |
| Expiry date | Jun 6, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A spring clip for clamping a heat sink module to an electronic module which has a pair of opposite side edge surfaces and a pair of spaced projections which extend from each side edge surface. The spring clip includes an elongated generally horizontal middle segment, a pair of end segments at opposite ends of the middle segment which extend in a first direction at an upward angle and a finger tab segment which is connected to the middle segment and which extends at an upward angle in a second direction which is opposite the first direction. A spring clip and heat sink assembly is formed by attaching a pair of spring clips to opposite ends of the heat sink for application to an electronic module. A heat dissipating assembly is formed by applying the spring clip and heat sink assembly to an electronic module which has a pair of projections extending from opposite edge surfaces of the electronic module. The horizontal middle segment of the spring clip can be moved from an inactive state above a respected pair of projections to an active state beneath the projections so that the middle segment is biased upwardly against the projections for clamping the heat sink to the electronic compo…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.