Surface seismic profile system and method using vertical sensor
US5581514A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 10, 1993 |
| Grant date | Dec 3, 1996 |
| Priority date | — |
| Expiry date | Nov 10, 2013 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01V1/3808
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The seismic profile system and method using vertical sensor arrays relate to obtaining a seismic profile under two highly reflective boundaries. The system includes a source of seismic energy disposed beneath the air/water boundary, a first pair of sensors arranged in vertical relation and spaced apart by a predetermined vertical spacing distance, and a second pair of sensors similarly situated and spaced from the first pair by a predetermined horizontal spacing distance. The first and second pairs of sensors are disposed below at least two highly reflective boundaries, which may be the air/water boundary and a mud/water boundary. According to the method, the source is moved between two points and data is collected from the first and second pairs of sensors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.