Heat sink assembly for a central processing unit of a computer
US5583746A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Nov 20, 1995 |
| Grant date | Dec 10, 1996 |
| Priority date | — |
| Expiry date | Nov 20, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat sink assembly for a central processing unit (C.P.U.) of a computer consists of a baseplate to which a fan is attached, a plurality of spacers, a corresponding plurality of plates, the spacers and plates each defining a central opening and being alternately stacked on the baseplate and surrounding the fan, thereby defining vents leading to a central passage defined by the central openings, and a cover plate defining a further central opening communicating with the central passage. The base plate, spacers, plates and cover plate are secured to each other by bolts and screws extending through holes defined therein. Clips can be received around the C.P.U., the baseplate and a lowermost plate to removably secure them together. Cool ambient air is drawn into the assembly unit by the fan via the vents, which then passes up the central passage, being warmed by heat originally generated by the C.P.U. to exit via the central opening of the cover plate thereby discharging excess heat from the heat sink assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.