Field emission element and process for manufacturing same
US5584739A · kind A · utility
19Cited by
6References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 8, 1994 |
| Grant date | Dec 17, 1996 |
| Priority date | — |
| Expiry date | Feb 8, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/31732
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A process for manufacturing a field emission element including a substrate, and an emitter and a gate each arranged on the substrate is provided. The emitter is formed at at least a tip portion thereof with an electron discharge section, which is formed of metal or semiconductor into a monocrystalline structure or a polycrystalline structure preferentially oriented in at least a direction perpendicular to the substrate by deposition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.