Surface polishing apparatus
US5584749A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 2, 1996 |
| Grant date | Dec 17, 1996 |
| Priority date | — |
| Expiry date | Jan 2, 2016 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B57/02
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A surface polishing apparatus includes a disk-like polishing tool, a polishing solution spray mechanism, and a polishing solution suction mechanism. The polishing tool has a work surface to which a polishing solution is supplied and against which a workpiece is pressed. The polishing tool is driven/rotated to surface-polish the workpiece. The polishing solution supply mechanism is disposed on the upstream side of the workpiece in the rotational direction of the polishing tool to supply a polishing solution to the work surface of the polishing tool. The polishing solution suction mechanism is disposed on the downstream side of the workpiece in the rotational direction of the polishing tool to draw and recover the polishing solution on the work surface of the polishing tool.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.