Wafer polishing apparatus
US5584751A · kind A · utility
264Cited by
3References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 27, 1996 |
| Grant date | Dec 17, 1996 |
| Priority date | — |
| Expiry date | Feb 27, 2016 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/32
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A wafer polishing apparatus increases the polishing uniformity by adjusting an abutting pressure of a retainer ting to an optimum value. A wafer holding head 32 of this apparatus has a head body 34, a carrier 46 provided within the head body 34, a retainer ring 50 arranged on the outer periphery of the carrier 46, a diaphragm 44 for pressing the carrier 46, a ring-shaped tube 54 which is made of an elastic material and mounted between the head body 34 and the retainer ring 50, and a second pressure regulating mechanism 60 for regulating a pressure of a fluid filled within the tube 54.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.