Bond site reinforcement in thermal bonded highloft non-wovens
US5585161A · kind A · utility
19Cited by
9References
10Claims
0Family size
Inventors
Key dates
| Filing date | Nov 12, 1993 |
| Grant date | Dec 17, 1996 |
| Priority date | — |
| Expiry date | Nov 12, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T442/698
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Provided is a supplement or additive to thermal bonded highloft nonwoven fiber masses bonded by the fusion of a matrix fiber and a heat reactive binder. The purpose of the supplement or additive is to reinforce and enhance the bonded fiber structure. The supplement is in the form of an embedment or filler.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.