Radiation-curable composition comprising a polydimethylsiloxane
US5585201A · kind A · utility
10Cited by
16References
12Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 5, 1995 |
| Grant date | Dec 17, 1996 |
| Priority date | — |
| Expiry date | Jun 5, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/21
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A radiation-curable composition that contains a radiation-curable component and a radiation-curable polydimethylsiloxane compound. The radiation-curable polydimethylsiloxane compound contains a polyoxyalkylene segment and is compatible with the radiation-curable component, so that the cured composition is relatively free from oranger-peel texture, haze, etc. Further, the cured composition provides improved frictional properties. The composition contains a significantly smaller amount of the polydimethylsiloxane than has been previously used. The composition is especially useful when applied to an optical recording disk.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.