Non-contact thickness measurement using UTG
US5585563A · kind A · utility
Inventor
Key dates
| Filing date | Jul 8, 1993 |
| Grant date | Dec 17, 1996 |
| Priority date | — |
| Expiry date | Jul 8, 2013 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2291/044
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A measurement structure for determining the thickness of a specimen without mechanical contact but instead employing ultrasonic waves including an ultrasonic transducer and an ultrasonic delay line connected to the transducer by a retainer or collar. The specimen, whose thickness is to be measured, is positioned below the delay line. On the upper surface of the specimen a medium such as a drop of water is disposed which functions to couple the ultrasonic waves from the delay line to the specimen. A receiver device, which may be an ultrasonic thickness gauge, receives reflected ultrasonic waves reflected from the upper and lower surface of the specimen and determines the thickness of the specimen based on the time spacing of the reflected waves.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.