Semiconductor chip card having selective encapsulation
US5585669A · kind A · utility
15Cited by
3References
25Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 18, 1995 |
| Grant date | Dec 17, 1996 |
| Priority date | — |
| Expiry date | May 18, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49124
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A chip card including a card base with a recess. A circuit support and a microcircuit is arranged on a circuit support surface which faces an interior of the recess and is spaced from the recess bottom. A raised portion is formed on the recess bottom and spaced from a cover section so as to divide the recess into two regions bounded by the recess bottom, the cover section and the raised portion. The first region is completely filled with an encapsulant and the second region is partly filled with the encapsulant.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.