IC chip for different type IC packages
US5585676A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 18, 1994 |
| Grant date | Dec 17, 1996 |
| Priority date | — |
| Expiry date | Apr 18, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D84/01
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An IC chip characterized in that at least two input pads and at least two output pads are respectively disposed symmetrical to each other about the center of the IC chip, at least two input/output pads are disposed symmetrical to each other about the center, at least one supply voltage pad is disposed in each of four equal sections formed by longitudinally and laterally dividing the IC chip, and at least one control voltage pad is disposed in each of these four sections. The IC chip can be connected by bonding to various types of IC packages having different configurations of the pins only by mounting in a proper direction without causing the bonding wires to bridge over the other constituent elements or to cross each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.