Mounting assembly for power semiconductors
US5586004A · kind A · utility
64Cited by
3References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 22, 1995 |
| Grant date | Dec 17, 1996 |
| Priority date | — |
| Expiry date | Jun 22, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02T10/72
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A mounting assembly for power semiconductors comprises a plurality of modules (20) arranged in a symmetrical arrangement around a central axis. Each module has one or more heat sink substrate surfaces (201,203) for the mounting of semiconductor components (205) and an internal passage (202) for passing a fluid cooling medium therethrough in order to cool the semiconductor components. The assembly may comprise a prismatic body (24) providing the substrate surfaces (243).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.