Circuit board having improved thermal radiation
US5586007A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Oct 13, 1995 |
| Grant date | Dec 17, 1996 |
| Priority date | — |
| Expiry date | Oct 13, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10681
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit board consisting of an insulating substrate, a die bonding pad for fixedly bonding a semiconductor element onto the insulating substrate, and a wiring layer, in such a manner that the die bonding pad and wire layer are formed on the insulating substrate. A first heat conducting/radiating layer formed on the portion of the surface of the insulating substrate where the wiring layer and the die bonding pad are not formed, in such a manner that the first heat conducting/radiating layer is thermally connected to the die bonding pad. A second heat conducting/radiating layer is formed on the rear surface of the insulating substrate, and a heat bridge through which the die bonding pad or the first heat conducting/radiating layer is connected to the second heat conducting/radiating layer. The circuit board is light and small, and high in heat radiating characteristic, and low in manufacturing cost.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.