Methods and assemblies for packaging opto-electronic devices and for coupling optical fibers to the packaged devices
US5586207A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Nov 29, 1993 |
| Grant date | Dec 17, 1996 |
| Priority date | — |
| Expiry date | Nov 29, 2013 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/08
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
In methods and assemblies for packaging opto-electronic devices and for coupling optical fibers to the packaged devices, a housing has a cavity for receiving an opto-electronic device and an opening into the cavity. A window is placed across the opening to seal the opto-electronic device in the cavity. The window comprises a plurality of substantially parallel optical fiber sections joined side-by-side. An alignment and retention arrangement is mechanically coupled to the housing and is operable to align an optical fiber to the opto-electronic device through the window and to retain the optical fiber in that alignment. The methods and assemblies are particularly applicable to cost reduced packaging of opto-electronic devices for communications applications.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.