Composition, and method for using same, for etching metallic alloys from a substrate
US5587103A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jan 17, 1996 |
| Grant date | Dec 24, 1996 |
| Priority date | — |
| Expiry date | Jan 17, 2016 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23F1/44
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A composition for optimally removing or etching metallic alloys from chemically compatible substrates with minimal damage to the substrate. The preferred composition is Ammonium Fluoride, Hydrofluoric Acid, Nitric Acid, Phosphoric Acid and Water in a specified range of quantities used to selectively remove an Aluminum and Silicon Alloy and Titanium film from a chemically compatible substrate. The composition is placed in contact with Stainless Steel, Silicon, or other organic or metallic substrates to remove, etch, or pattern homogenous or layered Aluminum, Silicon, Titanium and Copper Alloys from the substrate with minimal etching to the underlying substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.