Metal paste, process for producing same and method of making a metallic thin film using the metal paste
US5587111A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 29, 1991 |
| Grant date | Dec 24, 1996 |
| Priority date | — |
| Expiry date | Mar 29, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A metal paste comprising ultrafine particles of a metal. The particles have a particle size of 1000 angstroms (0.1 micron) or less and are individually uniformly dispersed in an organic solvent. A process for producing a metal paste comprises the steps of evaporating a metal in a vacuum chamber in an atmosphere of an inert gas at a pressure of 10 Torr or less and of collecting the vapor of the evaporated metal on a cooling surface in the form of ultrafine particles having a particle size of 1000 angstroms (0.1 micron) or less, wherein a vapor of an organic solvent is introduced into the vacuum chamber while the metal is being evaporated. A method for preparing a metallic thin film having a thickness of between 0.01 micron and 1 micron. A metal paste containing ultrafine metal particles having a diameter of 0.1 micron or less uniformly dispersed in an organic solvent is coated on a substrate, dried and sintered.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.