Method for manufacturing a coaxial interconnect
US5587119A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | May 26, 1995 |
| Grant date | Dec 24, 1996 |
| Priority date | — |
| Expiry date | May 26, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09809
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multi-chip-module comprising a plurality of vertically layered substrates and including a plurality of coaxial inter-connects formed between and through the substrate layers. Each of the coaxial inter-connects is formed by a process wherein: an outer hole (aperture) is drilled through the substrate and lined with an electrically conductive material to form an outer via; the outer via is filled with a dielectric material; and, an inner hole (aperture) is drilled through the dielectric material and filled with an electrically conductive material to form a center via. The characteristic impedance of the coaxial inter-connect is determined by the selection of the outer diameters of the drilled holes for the outer and center vias.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.