Epoxy resin mixtures containing phosphonic/phosphinic acid anhydride adducts

US5587243A · kind A · utility

Assignees

• Siemens Aktiengesellschaft · DE
• Hoechst GmbH · DE

Inventors

• Wolfgang von Gentzkow · Kleinsendelbach, DE
• J urgen Huber · Erlangen, DE
• Heinrich Kapitza · Fürth, DE
• Wolfgang Rogler · Erlangen, DE
• Hans-Jerg Kleiner · Kronberg, DE
• Dieter Wilhelm · Neu-Anspach, DE

Key dates

• Filing date: Sep 14, 1995
• Grant date: Dec 24, 1996
• Expiry date: Sep 14, 2015

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T428/31525
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

Epoxy resin mixtures for producing prepregs and composites that are available at low cost and can be processed well yield flame-retardant molding materials even without the addition of flame retardants, and these molding materials have a high glass transition temperature and also have an improved interlaminar adhesion and adhesion to copper when they contain the following components: PA1 a phosphorus-modified epoxy resin with an epoxy value of 0.02 to 1 mol/100 g, composed of structural units derived from PA2 (A) polyepoxy compounds with at least two epoxy groups per molecule and PA2 (B) phosphinic acid anhydrides and/or phosphonic acid anhydrides, and PA1 an aromatic polyamine as the hardener.