Mechanical printed circuit board/laminated multi chip module interconnect apparatus
US5587885A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jul 15, 1994 |
| Grant date | Dec 24, 1996 |
| Priority date | — |
| Expiry date | Jul 15, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0723
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
To facilitate the registered connection between a laminated multi chip module and an associated multi-tiered circuit board, spaced series of vias are formed transversely through the circuit board and module substrates between their opposite first and second sides. Gold plated BGA leads, offset from the module substrate vias, are formed on the first module substrate side on multi-layer plating structures disposed thereon and extending along the module via interior side surfaces. A spaced series of relatively shallow, circularly cross-sectioned socket areas, offset from the circuit board vias, are also formed on the first side of the circuit board. The sockets have diameters slightly larger that those of the generally ball-shaped BGA leads of the multi chip module, and are positioned on the same centerline pattern as the leads. After the circuit board vias and sockets are formed, a multi-layer metallic coating is deposited on their interiors and around their open ends on the first board side, with the coating being extended across the first board side between associated socket and via pairs. Like the BGA leads, this coating has a gold outer layer. The multi chip module is placed agai…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.