Low inductance surface-mount connectors for interconnecting circuit devices and method for using same
US5588848A · kind A · utility
18Cited by
3References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 8, 1994 |
| Grant date | Dec 31, 1996 |
| Priority date | — |
| Expiry date | Sep 8, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In accordance with the invention, a low inductance surface-mount connector comprises a slotted, hollow rectangular parallelepiped. The device permits interconnection by pick-and-place techniques, and the interconnection has advantageous qualities of compactness, low inductance, and mechanical compliance. A first circuit device having one or more circuit components is interconnected with a second circuit device by surface mounting such connectors on the first circuit device, providing corresponding solder pads on the second circuit device, and mounting the connectors of the first circuit device onto the pads of the second.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.