ZIF chip socket
US5588861A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Dec 30, 1994 |
| Grant date | Dec 31, 1996 |
| Priority date | — |
| Expiry date | Dec 30, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/1084
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention provides a pin grid array (PGA) socket for electrically connecting pins of an integrated circuit to a circuit substrate. The PGA socket according to the invention included a cover having insertion holes arranged in rows and columns for receiving the pins of the integrated circuit and a base for supporting a plurality of deflectable contacts. The cover provides a buttress extending from each insertion hole. The contacts are preferably freely supported in the base and spaced on either about 0.5 inch centers or on about 0.1 inch centers. The centerlines of the insertion holes are correspondingly spaced approximately 0.5 inches or approximately 0.1 inches. The cover preferably provides a camming means. The cover can be slidably attached to the base to permit the cover to cam over the surface of the base. When the pins have been inserted through the insertion holes, the buttresses provide support for the pins of the integrated circuit as they are moved with the cover to interface with the contacts and while the interface between the contacts and the pins is maintained. In one preferred embodiment means are also provided to support the contacts.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.