Patent · US Expired

Method of manufacturing a molding using a filler or an additive concentrated on an arbitrary portion or distributed at a gradient concentration

US5589129A · kind A · utility

33Cited by
17References
18Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJun 19, 1995
Grant dateDec 31, 1996
Priority date
Expiry dateJun 19, 2015

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L2224/73265
  • WIPO fieldOther special machines
  • WIPO sectorMechanical engineering

Abstract

A liquid resin composition prepared by mixing an ionic material and/or a chargeable material into a thermosetting or thermoplastic resin is injected into a mold having a predetermined inner shape, and a DC voltage is applied to the liquid resin composition to concentrate the ionic material and/or chargeable material on a desired portion or to distribute the ionic material and/or chargeable material continuously. Thereafter, the resin composition is thermally cured when the resin composition contains the thermosetting resin, or the resin composition is hardened by cooling when the resin composition contains the thermoplastic resin, thereby obtaining a molding having a predetermined shape.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.