Optical package and method of making
US5590232A · kind A · utility
43Cited by
10References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 16, 1995 |
| Grant date | Dec 31, 1996 |
| Priority date | — |
| Expiry date | Feb 16, 2015 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/4249
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An optical package including a housing defining a mounting area with leads formed in the housing each having a first end in the mounting area and a second end external to the housing. A semiconductor die with photonic devices thereon is mounted in the mounting area and electrically connected to the leads. The active light areas of the photonic devices is accessible through the mounting area. Optical fiber alignment structure is mounted in the mounting area for receiving optical fibers and aligning the optical fibers with the active light areas of the photonic devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.