Method of manufacturing connection terminals of flexible wiring pattern substrates
US5590465A · kind A · utility
18Cited by
9References
1Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 15, 1996 |
| Grant date | Jan 7, 1997 |
| Priority date | — |
| Expiry date | Mar 15, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49222
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A conductive metal wiring pattern 1 is printed and wired on a flexible insulation film 2, and has connection terminals 1a whose surfaces are treated into a solderable state by plating or the like. An overriding flexible insulation film 3 is formed such that it covers a portion excluding the connection terminals 1a. The connection terminals 1a are easily formed by printing, bonding and cutting out portions of the insulation film 2 between the connection terminals by a press to separate the connection terminal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.