Thermally conductive adhesive interface
US5591034A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 25, 1995 |
| Grant date | Jan 7, 1997 |
| Priority date | — |
| Expiry date | Jul 25, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31544
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A thermally conductive interface is provided suitable for thermal conduction, especially between electronic components. The preferred thermally conductive interface comprises an open structure fluoropolymer material, such as expanded polytetrafluoroethylene, with uncoated thermally conductive particles attached to solid portions thereof. The interface has numerous benefits over previously available material, such as improved thermal conductivity, high conformability, better compressibility, inherent porosity so as to provide air relief, improved stress relief, and high material compliance and resistance to fatigue during thermal cycling.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.