Patent · US Expired

Semiconductor device and method of fabrication

US5591666A · kind A · utility

3Cited by
6References
20Claims
0Family size

Assignee

Inventors

Key dates

Filing dateAug 7, 1995
Grant dateJan 7, 1997
Priority date
Expiry dateAug 7, 2015

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10S438/973
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

A method of fabricating semiconductor devices including defining an area on the surface of a substrate, selectively growing, on the area, a crystalline material with at least one defined crystallographic facet, and selectively growing a semiconductor device on the crystallographic facet. In a second embodiment, an area is defined on the surface of a substrate and chemical beam epitaxy is used to selectively grow, on the area, a layer of indium arsenide with at least one defined crystallographic facet.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.