Mounting for carrier bodies in an apparatus for the deposition of semiconductor material

US5593465A · kind A · utility

Assignee

• Wacker Chemie AG · DE

Inventors

• Dieter Seifert · Vilshofen an der Donau, DE
• Heinz Kraus · Zeilarn, DE

Key dates

• Filing date: Jun 14, 1995
• Grant date: Jan 14, 1997
• Expiry date: Jun 14, 2015

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C30B25/12
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

Mounting for carrier bodies in an apparatus for the deposition of semiconductor material on heated carrier bodies, having a fixed current leadthrough passed through the base plate of the deposition apparatus, an electrode holder, and a graphite electrode. There is also at least one spring element which is disposed between the current leadthrough and the electrode holder, which permits a movement of the electrode holder relative to the current leadthrough and which cushions this movement.