Fabrication of silicon microclusters and microfilaments
US5593742A · kind A · utility
3Cited by
6References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 24, 1995 |
| Grant date | Jan 14, 1997 |
| Priority date | — |
| Expiry date | Aug 24, 2015 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC30B29/06
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An ablation process by which fused deposits of silicon particles are accuated on a substrate of selected material in accordance with whether microclusters of spherical configurations or microfilaments of cylindrical configurations are to be fabricated. Silicon ablation is accomplished in an inert gas atmosphere with an excimer laser that generates light pulses of which the wavelength and frequency are controlled to fix the energy level thereof. The pressure of the inert gas atmosphere is also controlled in accordance with whether microclusters or microfilaments are to be fabricated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.