Feedthrough pin and process for its preparation, and electrical feedthrough made therewith
US5595514A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 19, 1994 |
| Grant date | Jan 21, 1997 |
| Priority date | — |
| Expiry date | Jul 19, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49204
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A feedthrough (34) is formed of a feedthrough plate (44) having at least one bore (46) therethrough and a feedthrough pin (48) hermetically sealed into the bore (46). The feedthrough pin (48) includes an elongated pin (50) having an axis of elongation (52), a recess (54) in at least one end of the pin (50), the recess (54) extending parallel to the axis of elongation (52), and a gold coating (56) within the recess (54). There are preferably a plurality of bores (46) in the feedthrough plate (48) and a corresponding plurality of the feedthrough pins (48). The gold coatings (56) at the ends of the feedthrough pins (48) are desirably lapped to ensure coplanarity and a smooth surface finish especially suited for wire bonding or tab bonding.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.